Some CMP slurries used for wafer polishing can be damaged during handling. The damage results in agglomerated particles that can cause defects during wafer polishing. This testwork was part of a study to determine if slurry damage is the result of shear, as is commonly believed, or alternatively, cavitation. The data suggest that cavitation may play a more significant role in agglomeration of slurry particles than shear and that slurry handling equipment design should focus on eliminating liquid cavitation rather than controlling shear.